Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of Ultramid® A3Z HP BK20465 - PA66 - BASF

Material Data Center offers the following functions for Ultramid® A3Z HP BK20465:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces

Check here, which other Ultramid A datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Mechanical properties - Thermal properties - Other properties
Any use of this information falls under the rules of our disclaimer.
Product Texts
Impact-modified and stabilized injection moulding grade for components and housing with good low temperature impact resistance.
Mechanical propertiesdry / condUnitTest Standard
ISO Data
Tensile Modulus 1900 / - MPa ISO 527
Yield stress 50 / - MPa ISO 527
Yield strain 5 / - % ISO 527
Nominal strain at break 45 / - % ISO 527
Charpy impact strength, +23°C N / - kJ/m² ISO 179/1eU
Charpy impact strength, -30°C N / - kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 90 / - kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 28 / - kJ/m² ISO 179/1eA
Thermal propertiesdry / condUnitTest Standard
ISO Data
Melting temperature, 10°C/min 262 / * °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 64 / * °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 170 / * °C ISO 75-1/-2
Other propertiesdry / condUnitTest Standard
Density 1070 / - kg/m³ ISO 1183
Characteristics
Processing
Injection Molding
Delivery form
Black
Regional Availability
North America
Other text information
Injection molding
Max. Water content: 0.20%
Product is supplied in sealed containers and
drying prior to molding is not required. If drying
becomes necessary, a dehumidifying or desiccant dryer
operating at 80 degC (176 degF) is recommended. Drying time is
dependent on moisture level, but 2-4 hours is generally
sufficient.
Further information concerning safe handling procedures
can be obtained from the Material Safety Data Sheet.
Alternatively, please contact your BASF representative.
PROCESSING
Melt Temperature 280-304 degC (536-580 degF)
Mold Temperature 60-100 degC (140-212 degF)
Injection and Packing Pressure 35-125 bar (500-1500 psi)
Back Pressure 0-0.35 MPa (0-50 psi)
Screw Speed 40-80 rpm
Screw Compression Ratio 3:1 to 4:1

This product can be processed over a wide range of mold
temperatures; however, for applications where aesthetics are
critical, a mold surface temperature of 60-100 degC (140-212 degF)
is recommended.

Injection pressure controls the filling of the part and should
be applied for 90% of ram travel. Packing pressure affects
the final part and can be used effectively in controlling
sink marks and shrinkage. It should be applied and maintained
until the gate area is completely frozen off.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.